Balance Seal™ Potting Compound

Product Overview

Balance Seal™ Epoxy Potting Compound is a high-performance, two-component filled epoxy system designed for reliable sealing, insulation, and encapsulation of electronic assemblies and sensitive components. Engineered for durability and long-term protection, this compound provides excellent mechanical strength, chemical resistance, and environmental protection for a wide range of electrical and electronic applications.

Key Features

Two-component filled epoxy system (Resin + Hardener)
Excellent sealing and encapsulation performance
Superior electrical insulation properties
Strong adhesion to metals, plastics, and electronic substrates
Good resistance to moisture, vibration, and environmental stress
Fully machinable after curing (drilling, grinding, and machining possible)

Applications

Potting and encapsulation of electronic circuits
Protection of sensors, transformers, and control modules
Electrical component sealing and insulation
Industrial electronic assemblies and gadgets
Protection of PCB assemblies against moisture, dust, and vibration

Technical Information

Mixing Ratio: 10 : 1 (100 parts Resin : 10 parts Hardener)
Initial Setting Time: 4 – 6 hours (at room temperature)
Full Cure Time: Approximately 16 hours (at room temperature)
Post-Cure Properties: Fully cured material can be drilled, ground, or machined as required
Pack Size: Net Weight 1 kg

Application Guidelines

Ensure surfaces are clean, dry, and free from oil, grease, or dust.

Mix resin and hardener thoroughly in the specified ratio (10:1) until a uniform mixture is obtained.

Pour or apply the mixed compound into the required area for sealing or encapsulation.

Allow to set undisturbed for the recommended curing time to achieve optimal performance.

Storage & Handling

Store in a cool, dry place away from direct sunlight. Keep containers tightly closed when not in use. Follow recommended safety precautions while handling epoxy materials.